In April 2023, Mr. Qiu Feng, the General Manager of Gensol collaborated with experts and professors from Shenzhen University, Shenzhen University Institute of Micro-Nano Optoelectronics, Shenzhen Institute of Information Technology, Dongguan Zhonggan Semiconductor Co., Ltd., Dongguan Nanfang Semiconductor Technology Co., Ltd., and Chang Gung University in Taiwan. Together, they published an academic article titled “Low Contact Resistivity Vertical GaN Schottky Barrier Diode with Ultrathin ITO Interface Layer on N-Polarity Surface” in the renowned journal “IEEE Transactions on Electron Devices.”
The Institute of Electrical and Electronics Engineers (IEEE) is an international association of electronics and information science engineers and is one of the world’s largest professional technical organizations in terms of membership, with 360,000 members from 175 countries. IEEE has established influence in various fields, including aerospace systems, computer technology, communications, biomedical engineering, power, consumer electronics, and more. It publishes professional technical journals, organizes various society conferences, provides technical communications, and collaborates on activities in education and professional technical fields. IEEE is an academically influential international organization.
This article presents the first study of an ohmic contact structure for high-performance gallium nitride Schottky barrier diodes (SBD) based on indium tin oxide (ITO)/Ti/Al/Ni/Au. The ITO interface layer effectively alleviates the field plate (FLP) effect and achieves a lower work function at the interface. As a result, high-quality ohmic contact is achieved on the N-polarity surface of GaN, effectively reducing RON,sp. The work reports the lowest ρc1.04×109 under a known anode size, demonstrating significant potential for the development of vertical GaN SBD.
In the future, Gensol will continue to collaborate deeply with universities and research institutes, jointly conducting research projects, facilitating technology transfer, and promoting industrialization. This collaboration aims to contribute to the transformation of research results into practical applications and economic value.
